Inphi component enables servers and workstations to handle greater volumes of data and support more memory modules
PORTLAND, Ore. (SC09) November 16, 2009 – Inphi Corporation, a high-speed analog semiconductor company, announced that it is sampling its new server memory buffer, designed to address the performance and capacity challenges of today’s servers and workstations. This component is driving the creation of a new class of memory modules – LRDIMMs, or load-reduced, dual-inline memory modules – capable of delivering upward of four times the memory capacity and nearly double the bandwidth. When server and workstation manufacturers adopt this new approach, they will be able support an increased number of memory modules, which themselves offer increased capacity and operate at higher speeds.
“With the rise of virtualization and the move to cloud computing, memory density and server performance become key issues for data centers,” said Young K. Sohn, president and CEO of Inphi Corporation. “Working closely with key memory module providers, CPU suppliers, and server and workstation manufacturers, Inphi developed this unique solution to break the current bottleneck and deliver the much-needed higher bandwidth and memory capacity demanded by today’s data centers.”
Driving the Demand: Virtualization and Multi-core CPUs
As servers utilize more multicore CPUs and become increasingly virtualized, current memory module capacity cannot keep pace with demand, and server CPUs are limited by how much memory they can address over the memory channel. Inphi’s Isolation Memory Buffer, based on its innovative Isolation Memory Buffer (iMB™) technology, enables data center servers to take better advantage of multicore and virtualization technologies by isolating the CPU from the memory components and then buffering the memory, I/O, control and data signals.
With the availability of Inphi’s Isolation Memory Buffer, memory module suppliers are designing a new class of products: LRDIMMs. Unlike traditional registered DIMMs (RDIMMs) that limit the amount of memory that can be accommodated to their loading profile, LRDIMMs replace the register with an isolated memory buffer and significantly reduce the load. Inphi’s core technology offers the module manufacturers an opportunity to deliver a solution that can quadruple server memory capacity and nearly double the bandwidth.
Inphi to demonstrate its Isolation Memory Buffer at SC09
At SC09, the 22nd annual supercomputing conference, Inphi will have the first public demonstration of its Isolation Memory Buffer. SC09 will take place November 14 to 20, 2009, at the Oregon Convention Center in Portland, Ore.
In its booth (#1255) at SC09, Inphi will show bandwidth-intensive applications running side-by-side on comparably configured systems with and without the Inphi buffer. Visitors to the Inphi booth will see that the system with the iMB-based component delivers significantly more memory capacity and bandwidth than a system using standard RDIMM memory modules.
Pricing and Availability
Engineering samples of Inphi’s iMB01-GS02 Isolation Memory Buffer are offered in a RoHS-compliant flip chip BGA and available now for qualified customers. Prices for initial engineering samples are $26.00. Fully qualified parts are expected to begin shipping in Q1 of 2010.
Since first unveiling details of its iMB technology in June 2009, Inphi has worked closely with the JEDEC standards body and with the entire server technology ecosystem to make the benefits of the iMB technology available in standardized form. Of the multiple approaches to memory buffer (MB) technology, JEDEC has chosen Inphi’s single-chip configuration as the basis for the standard, which is expected to be finalized in the first quarter of 2010. At that time, Inphi plans to have JEDEC-compliant iMB parts available.
For more information, visit http://www.inphi.com/products-technology/server-storage-products/products/imbtrade01-gs.php to view Inphi’s product overview and visit http://www.inphi.com/products/whitepapers/iMB-White-Paper.pdf to view Inphi’s white paper
Inphi Corporation, a high-speed analog semiconductor company, provides leading-edge interface components that operate at critical interfaces within cloud computing environments, addressing the bandwidth, capacity and power issues faced by data centers and 40G/100G networks. By leveraging its core competencies in advanced analog circuit design, signal integrity, power management, packaging and process technologies, Inphi has taken a leadership role in the markets it serves. Inphi’s more than 150 analog components push the boundaries of existing server, storage and broadband networking applications while paving the way for new ones. To learn more about Inphi, visit www.inphi.com.