Inphi First to Deliver on Industry Milestone with Lowest Power, Highest Performance Gearbox for Next-Generation 100G CFP Modules and Line Cards
SANTA CLARA, Calif., Tuesday, September 11, 2012 – Inphi Corporation (NYSE: IPHI), a leading provider of high-speed, mixed signal semiconductor solutions for the communications and computing markets, today announcedgeneral availability of the world’s first production ready 100G CMOS PHY/SerDes Gearbox (GB) ICs for next-generation data center, enterprise and service provider line cards. The GB ICs are available in two variants:
Built in a mature generic digital CMOS process and using mainstream ball grid array (BGA) packaging techniques, the Inphi GB ICs are built to support volume production while exceeding critical parameters in the IEEE 802.3ba, OIF-28G-VSR and ITU specifications.
Inphi’s 100G CMOS PHY/SerDes GB is based on the unique and groundbreaking iPHY™ architecture which is purpose built for client side networking interfaces that push the envelope on power, performance, integration, latency and cost. When compared to available competing SiGe and FPGA solutions, Inphi’s GB consumes one-third the power and half the area making it an ideal choice for high density front panel line card implementations. Consuming less than 2.5-W and housed in a 16x16mm package, Inphi’s 100G GB is the lowest power and smallest footprint CMOS GB IC in the industry.
Social media, big data analytics and streaming video are just some of the trends driving the global economy’s relentless hunger for more bandwidth. In the drive for energy efficient green datacenter designs, it is becoming critical to measure and save every watt per port and per IOPS. Inphi’s innovative 100G platform IC solution, the 100G CMOS PHY/SerDes GB and the already announced IN2841TA transimpedance amplifier/limiting amplifier, will enable total solutions to easily upgrade to 100G client interfaces while retaining a lower carbon footprint.
“After being the first company globally to sample a 100G CMOS PHY/SerDes GB last year, we are now pleased to announce production availability. This industry-first speaks volumes about our company’s innovative direction and commitment to achieve goals and Inphi is proud to achieve this industry milestone,” said Siddharth Sheth, vice president of marketing for Inphi’s high-speed connectivity products.
According to Jag Bolaria, senior analyst at The Linley Group, “The availability of a production ready 100G CMOS PHY/SerDes GB paves the way for the next wave of low cost and higher volume deployments of 100G client interfaces. By being the first to reach this milestone, Inphi is in a leading position to benefit from these new deployments with a 100G GB IC that leads on power and feature-set.”
iPHY 100G CMOS PHY/SerDes GB Now in Production
The iPHY GB ICs are a single-chip, 100GBASE-xR4 and OTL4.4 10:4 GB for high-density 100G line cards with 25-28 Gbps interfaces. Additional technical advantages include:
Come See Us at the European Conference on Optical Communication (ECOC)
Inphi is showcasing its latest 100G platform level solutions in its booth #603 at ECOC 2012 in Amsterdam, on September 17-19, 2012.
Inphi Corporation is a leading provider of high-speed, mixed signal semiconductor solutions for the communications and computing markets. Inphi’s end-to-end data transport platform delivers high signal integrity at leading-edge data speeds, addressing performance and bandwidth bottlenecks in networks, from fiber to memory. Inphi’s solutions minimize latency in computing environments and enable the rollout of next-generation communications infrastructure. Inphi’s solutions provide a vital interface between analog signals and digital information in high-performance systems, such as telecommunications transport systems, enterprise networking equipment, enterprise and data center servers, and storage platforms. To learn more about Inphi, visit www.inphi.com.
Inphi, the Inphi logo and Think fast are registered trademarks of Inphi Corporation. iSCAN and iPHY are also trademarks of Inphi Corporation. All other trademarks used herein are the property of their respective owners.