SANTA CLARA, Calif., September 13, 2010 – Inphi Corporation, a fabless provider of high-speed analog semiconductor solutions for the communications and computing markets, today announced sampling of its next generation of Isolation Memory Buffer (iMB™) 02-GS02 for cloud computing. The new Inphi iMB component is designed to address the critical CPU/memory bottleneck in data center servers and high-performance computing systems, allowing them to operate at higher speeds with greater memory capacity and better power efficiency.
“Intel collaborates with ecosystem leaders to enable the best performance on Intel® architecture,” said Boyd Davis, Vice President, Intel Architecture Group and General Manager, Data Center Group Marketing, Intel Corporation. “Inphi’s JEDEC-compliant memory buffer, the iMB 02-GS02, will augment Intel® server processors by offering our customers greater memory capacity to address growing memory density issues while keeping additional power consumption at a minimum.”
“Micron’s DDR3 load-reduced DIMMs (LRDIMMs) enable servers to increase memory capacity while also increasing system performance,” said Robert Feurle, Vice President of DRAM marketing at Micron. “Micron’s collaboration with Inphi on their new JEDEC-compliant iMB02-GS02 Memory Buffer enables us to provide server customers with unprecedented high-density memory options.”
“Our new memory buffer is designed to facilitate high-memory capacity on next-generation DDR3 servers designed for virtualization, cloud computing and other high-capacity applications,” said Young K. Sohn, President and CEO of Inphi. “As an active participant in the JEDEC standards body that drove the memory specifications, Inphi understands the importance of using standards to help ensure compatibility and interoperability.”
Fully compliant with the proposed Memory Buffer specification as defined by JEDEC, the iMB 02-GS02 is compatible with the current generation of DDR3-based server systems and helps to facilitate a transition to higher capacity DIMM, called Load-Reduced DIMM. The iMB 02-GS02 is important to memory subsystem operation at 1600 MT/s while maintaining favorable power consumption.
Unlike traditional registered DIMMs that limit the amount of server memory that can be installed due to their loading profile, LRDIMMs replace the register with an isolation memory buffer which reduces the load. The new scheme enables more ranks of dynamic RAM (DRAM) to be populated on the memory module and more modules to be used in a system. Adoption of the iMB allows up to four times the memory capacity to be installed in a server platform, resulting in increases to server bandwidth as well.
Engineering samples of Inphi’s iMB 02-GS02 Isolation Memory Buffer are available now for qualified customers. For more information, please visit Inphi’s Booth #425 at the Intel Developer Forum (IDF) taking place September 13-15, 2010 in San Francisco, California or visit www.inphi.com.
Inphi Corporation is a fabless provider of high-speed analog semiconductor solutions for the communications and computing markets, providing high signal integrity at leading-edge data speeds that are designed to address bandwidth bottlenecks in networks, minimize latency in computing environments and enable the rollout of next generation communications infrastructure. Inphi’s solutions provide a vital interface between analog signals and digital information in high-performance systems, such as telecommunications transport systems, enterprise networking equipment, enterprise and data center servers, storage platforms, test and measurement equipment and military systems. To learn more about Inphi, visit www.inphi.com.
Inphi is a registered trademark of Inphi Corporation. All other trademarks used herein are the property of their respective owners.